A System for Liquid Cooling of Electronic Elements with EHD Pumping Mechanism

A System for Liquid Cooling of Electronic Elements with EHD Pumping Mechanism

M. Tański1, M. Kocik1, M. Oleksy2, J. Kraśniewski2, A. Hapka2, and W. Janke2

1Centre for Plasma and Laser Engineering, The Szewalski Institute of Fluid Flow Machinery, Poland
2Department of Electronics and Computer Science, Technical University of Koszalin, Poland

Abstract- In this paper a proposed system is presented for cooling electronic elements where liquid coolant flow is induced using miniature injection Electrohydrodynamic (EHD) pumps. A Semiconductor CSD02060 diode packaged in TO-220 with an integrated heat exchanger was used as the cooled electronic element. We experimentally studied and numerically simulated the thermal characteristics of the diode cooled with EHD flow in the function of coolant flowrate. Results show that EHD micropumps can be successfully applied for cooling electronic elements such as the CSD02060 diode. The transient thermal impedance of the tested diode was 7.8°C/W for coolant flowrate of 1.5 ml/min.

Keywords-Cooling system, electrohydrodynamic flow, EHD, integrated heat-exchanger

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